For Sensing Device

We are working on developing new technologies such as fine hole processing technology, laser processing technology and printed wiring.

For Battery and Camera Module

We respond to high clean needs such as protective film processed products and molded products in the application of preventing foreign matter adhesion.
For FPC, Substrate and Communication Module

We provide functional materials such as composite processing of metal (foil) material and thermoset adhesive sheet.
For Light receiving/emitting Device and Module

We propose to combine functional materials with our processing technology.
For Haptic Device

We are working on proposing precision machining of OCA (optical double-sided tape) and cushioning material.
For Sensing Device

We are working on developing new technologies such as fine hole processing technology, laser processing technology and printed wiring.
Embossed Carrier Tape

We propose total production from design to shipment with short delivery time.
Taping Service

We support a wide range of taping services which can handle from small quantities of various types to mass production and give proposals for in-house production.
Soft/Hard Tray

We offer delivery trays that meet customer's requirements from large parts to small precision parts.